Adhesive bonding of microfluidic chips: influence of process parameters

17.07.2010

Riegger L, Strohmeier O, Faltin B, Zengerle R, Koltay P

J. Micromech. Microeng. 20,  087003 (5pp)

J. Micromech. Microeng.       online article

In this work, the influence of process parameters for adhesive bonding as a versatile approach for the sealing of polymer microfluidic chips is investigated. Specifically, a process chain comprising pre-processing, adhesive transfer as well as post-processing is presented and parameter recommendations are provided. For best bonding results, it is recommended to provide 2.5 ?m thin layers and to integrate capture channels near large, featureless areas to compensate for variations in processing.