Fabrication of highly porous platinum electrodes for micro-scale applications by pulsed electrodeposition and dealloying
15.11.2013
Köhler C, Kloke A, Drzyzga A, Zengerle R, Kerzenmacher S
J Power Source 242; 255-263
We present the implementation and optimization of a novel electrodeposition method for the fabrication of highly porous platinum electrodes. It is based on the co-deposition of platinum and copper and the selective dealloying of copper in a pulsed manner. The new process yields mechanically stable platinum electrodes with roughness factors of up to RF = 6500 ± 700, compared to the state-of-the-art cyclic electrodeposition method this corresponds to an improvement in RF by 111 %.
