Through-holes, cavities and perforations in polydimethylsiloxane (PDMS) chips
22.09.2014
Santisteban TS, Zengerle R, Meier M.
RSC Adv., 2014, 4, 48012-48016
We present a method to fabricate through-holes between 10 to 180 µm between polydimethylsiloxane (PDMS) layers of microfluidic large-scale integration platforms. The presented process parameters can easily be adapted to specific needs in fabrication of multi-layer PDMS arrangements by following the systematic parameter screening.
